According to a May 15, 2025, report from FinanceWorld, information from the National Intellectual Property Administration shows that Shenzhen Anpin Organosilicon Materials Co., Ltd., Huizhou Anpin New Materials Co., Ltd., and Yueyang Anpin New Materials Co., Ltd. have applied for a patent titled "Thermally Conductive Silicone Gel Composition and Preparation Method," with the publication number CN119979003A and a filing date of January 2025.
The patent abstract states that the invention provides a thermally conductive silicone gel composition and preparation method, comprising a thermally conductive composite filler premix, silane coupling agent, and hydrogen-containing silicone oil. Specifically: The thermally conductive composite filler powder is sequentially provided with a surface layer, an intermediate layer, and a core layer from the surface to the interior; the hardness of the surface layer < the intermediate layer < the core layer; the surface layer is connected to the intermediate layer and consists of first thermally conductive filler powder; the intermediate layer is connected to the core layer and includes second thermally conductive filler powder; the core layer is third thermally conductive filler powder; the particle size of the thermally conductive composite filler powder is ≤50μm; the particle size of the first thermally conductive filler powder < the second thermally conductive filler powder < the third thermally conductive filler powder; the weight ratio of the first, second, and third thermally conductive filler powders is 100-400:400-800:1200-2000; and the weight ratio of the thermally conductive composite filler premix to the silane coupling agent and hydrogen-containing silicone oil is 2100:10-16:5-11. The thermally conductive silicone gel composition of the invention has high thermal conductivity, low wear, and low oil bleeding performance, is suitable for stencil printing, and is particularly suitable for use in high-temperature hot oil immersion environments.
Tianyancha data shows that Shenzhen Anpin Organosilicon Materials Co., Ltd., established in 2004 and located in Shenzhen, is an enterprise mainly engaged in the manufacture of chemical raw materials and chemical products. The enterprise has a registered capital of 50 million RMB. Through Tianyancha big data analysis, Shenzhen Anpin Organosilicon Materials Co., Ltd. has invested in 7 enterprises, participated in 2 bidding projects, has 23 trademark information records and 92 patent information records, and also has 5 administrative licenses.
Huizhou Anpin New Materials Co., Ltd., established in 2012 and located in Huizhou, is an enterprise mainly engaged in the rubber and plastic products industry. The enterprise has a registered capital of 50 million RMB. Through Tianyancha big data analysis, Huizhou Anpin New Materials Co., Ltd. has 26 patent information records and 41 administrative licenses.
Yueyang Anpin New Materials Co., Ltd., established in 2023 and located in Yueyang, is an enterprise mainly engaged in the manufacture of chemical raw materials and chemical products. The enterprise has a registered capital of 100 million RMB. Through Tianyancha big data analysis, Yueyang Anpin New Materials Co., Ltd. has participated in 47 bidding projects, has 5 patent information records, and also has 9 administrative licenses.
This article is sourced from FinanceWorld.